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BTA312B-800C
3Q Hi-Com Triac
Rev. 02 -- 30 November 2010 Product data sheet
1. Product profile
1.1 General description
Planar passivated high commutation three quadrant triac in a SOT404 plastic package intended for use in circuits where high static and dynamic dV/dt and high dI/dt can occur. This "series C" triac will commutate the full RMS current at the maximum rated junction temperature without the aid of a snubber.
1.2 Features and benefits
3Q technology for improved noise immunity High commutation capability with maximum false trigger immunity High immunity to false turn-on by dV/dt High voltage capability Planar passivated for voltage ruggedness and reliability Surface mountable package Triggering in three quadrants only
1.3 Applications
Electronic thermostats (heating and cooling) High power motor controls e.g. washing machines and vacuum cleaners Rectifier-fed DC inductive loads e.g. DC motors and solenoids
1.4 Quick reference data
Table 1. Symbol VDRM ITSM Quick reference data Parameter repetitive peak off-state voltage non-repetitive peak on-state current RMS on-state current full sine wave; Tj(init) = 25 C; tp = 20 ms; see Figure 4; see Figure 5 full sine wave; Tmb 101 C; see Figure 3; see Figure 1; see Figure 2 Conditions Min Typ Max Unit 800 95 V A
IT(RMS)
-
-
12
A
NXP Semiconductors
BTA312B-800C
3Q Hi-Com Triac
Quick reference data ...continued Parameter gate trigger current Conditions VD = 12 V; IT = 0.1 A; T2+ G+; Tj = 25 C; see Figure 7 VD = 12 V; IT = 0.1 A; T2+ G-; Tj = 25 C; see Figure 7 VD = 12 V; IT = 0.1 A; T2- G-; Tj = 25 C; see Figure 7 Min 2 2 2 Typ Max Unit 35 35 35 mA mA mA
Table 1. Symbol IGT
Static characteristics
2. Pinning information
Table 2. Pin 1 2 3 mb T1 T2 G T2 Pinning information Symbol Description main terminal 1 main terminal 2 gate mounting base; main terminal 2
2 1 3 mb T2
sym051
Simplified outline
Graphic symbol
T1 G
SOT404 (D2PAK)
3. Ordering information
Table 3. Ordering information Package Name BTA312B-800C D2PAK Description Version plastic single-ended surface-mounted package (D2PAK); 3 leads SOT404 (one lead cropped) Type number
BTA312B-800C
All information provided in this document is subject to legal disclaimers.
(c) NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 02 -- 30 November 2010
2 of 14
NXP Semiconductors
BTA312B-800C
3Q Hi-Com Triac
4. Limiting values
Table 4. Symbol VDRM IT(RMS) ITSM Limiting values Parameter repetitive peak off-state voltage RMS on-state current non-repetitive peak on-state current full sine wave; Tmb 101 C; see Figure 3; see Figure 1; see Figure 2 full sine wave; Tj(init) = 25 C; tp = 20 ms; see Figure 4; see Figure 5 full sine wave; Tj(init) = 25 C; tp = 16.7 ms I2t dIT/dt IGM PGM PG(AV) Tstg Tj I2t for fusing rate of rise of on-state current peak gate current peak gate power average gate power storage temperature junction temperature over any 20 ms period tp = 10 ms; sine-wave pulse IT = 20 A; IG = 0.2 A; dIG/dt = 0.2 A/s Conditions Min -40 Max 800 12 95 105 45 100 2 5 0.5 150 125 Unit V A A A A2s A/s A W W C C
In accordance with the Absolute Maximum Rating System (IEC 60134).
50 IT(RMS) (A) 40
003aab687
15 IT(RMS) (A)
003aab686
10 30
20 5 10
0 10-2
10-1
1 10 surge duration (s)
0 -50
0
50
100
150 Tmb (C)
Fig 1.
RMS on-state current as a function of surge duration; maximum values
Fig 2.
RMS on-state current as a function of mounting base temperature; maximum values
BTA312B-800C
All information provided in this document is subject to legal disclaimers.
(c) NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 02 -- 30 November 2010
3 of 14
NXP Semiconductors
BTA312B-800C
3Q Hi-Com Triac
16 Ptot (W) 12
003aab690
conduction angle (degrees) 30 60 90 120 180
form factor a 4 2.8 2.2 1.9 1.57
= 180 120
90 60 30
8
4
0 0 3 6 9 IT(RMS) (A) 12
Fig 3.
100 ITSM (A) 80
Total power dissipation as a function of RMS on-state current; maximum values
003aab680
60
40
IT
ITSM t 1/f Tj(init) = 25 C max
20
0 1 10
102 number of cycles (n)
103
Fig 4.
Non-repetitive peak on-state current as a function of the number of sinusoidal current cycles; maximum values
BTA312B-800C
All information provided in this document is subject to legal disclaimers.
(c) NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 02 -- 30 November 2010
4 of 14
NXP Semiconductors
BTA312B-800C
3Q Hi-Com Triac
103 ITSM (A)
(1)
003aab691
102
IT ITSM t tp Tj(init) = 25 C max
10 10-5
10-4
10-3
10-2
tp (s)
10-1
Fig 5.
Non-repetitive peak on-state current as a function of pulse duration; maximum values
BTA312B-800C
All information provided in this document is subject to legal disclaimers.
(c) NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 02 -- 30 November 2010
5 of 14
NXP Semiconductors
BTA312B-800C
3Q Hi-Com Triac
5. Thermal characteristics
Table 5. Symbol Rth(j-mb) Thermal characteristics Parameter thermal resistance from junction to mounting base thermal resistance from junction to ambient Conditions full cycle; see Figure 6 half cycle; see Figure 6 printed circuit board mounted; minimum footprint Min Typ 55 Max 1.5 2 Unit K/W K/W K/W
Rth(j-a)
10 Zth(j-mb) (K/W) 1
(1)
003aab775
10-1
(2)
P
10-2
tp
t
10-3 10-5
10-4
10-3
10-2
10-1
1 tp (s)
10
(1) Unidirectional (half cycle) (2) Bidirectional (full cycle) Fig 6. Transient thermal impedance from junction to mounting base as a function of pulse duration
BTA312B-800C
All information provided in this document is subject to legal disclaimers.
(c) NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 02 -- 30 November 2010
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NXP Semiconductors
BTA312B-800C
3Q Hi-Com Triac
6. Characteristics
Table 6. Symbol IGT Characteristics Parameter gate trigger current Conditions VD = 12 V; IT = 0.1 A; T2+ G+; Tj = 25 C; see Figure 7 VD = 12 V; IT = 0.1 A; T2+ G-; Tj = 25 C; see Figure 7 VD = 12 V; IT = 0.1 A; T2- G-; Tj = 25 C; see Figure 7 IL latching current VD = 12 V; IG = 0.1 A; T2+ G+; Tj = 25 C; see Figure 8 VD = 12 V; IG = 0.1 A; T2+ G-; Tj = 25 C; see Figure 8 VD = 12 V; IG = 0.1 A; T2- G-; Tj = 25 C; see Figure 8 IH VT VGT holding current on-state voltage gate trigger voltage VD = 12 V; Tj = 25 C; see Figure 9 IT = 15 A; Tj = 25 C; see Figure 10 VD = 12 V; IT = 0.1 A; Tj = 25 C; see Figure 11 VD = 400 V; IT = 0.1 A; Tj = 125 C; see Figure 11 ID dVD/dt dIcom/dt off-state current rate of rise of off-state voltage rate of change of commutating current VD = 800 V; Tj = 125 C VDM = 536 V; Tj = 125 C; exponential waveform; gate open circuit VD = 400 V; Tj = 125 C; IT(RMS) = 12 A; dVcom/dt = 20 V/s; gate open circuit; "without snubber" condition Dynamic characteristics 500 20 V/s A/ms Min 2 2 2 0.25 Typ 1.3 0.8 0.4 0.1 Max 35 35 35 50 60 50 35 1.6 1.5 0.5 Unit mA mA mA mA mA mA mA V V V mA
Static characteristics
tgt
gate-controlled turn-on ITM = 20 A; VD = 800 V; IG = 0.1 A; time dIG/dt = 5 A/s
-
2
-
s
BTA312B-800C
All information provided in this document is subject to legal disclaimers.
(c) NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 02 -- 30 November 2010
7 of 14
NXP Semiconductors
BTA312B-800C
3Q Hi-Com Triac
3
(1)
001aac669
3 IL IL(25C) 2
001aab100
IGT IGT(25C) 2
(2)
(3)
1
1
0 -50
0
50
100 Tj (C)
150
0 -50
0
50
100 Tj (C)
150
(1) T2- G(2) T2+ G(3) T2+ G+ Fig 7. Normalized gate trigger current as a function of junction temperature
3 IH IH(25C)
001aab099
Fig 8.
Normalized latching current as a function of junction temperature
003aab678
40 IT (A) 30
2
20
1
10
(1)
(2)
(3)
0 -50
0
50
100 Tj (C)
150
0 0 0.5 1 1.5 2 VT (V) 2.5
Vo = 1.127 V; Rs = 0.027 (1) Tj = 125 C; typical values (2) Tj = 125 C; maximum values (3) Tj = 25 C; maximum values Fig 9. Normalized holding current as a function of junction temperature Fig 10. On-state current as a function of on-state voltage
BTA312B-800C
All information provided in this document is subject to legal disclaimers.
(c) NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 02 -- 30 November 2010
8 of 14
NXP Semiconductors
BTA312B-800C
3Q Hi-Com Triac
1.6 VGT VGT(25C) 1.2
001aab101
0.8
0.4 -50
0
50
100 Tj (C)
150
Fig 11. Normalized gate trigger voltage as a function of junction temperature
BTA312B-800C
All information provided in this document is subject to legal disclaimers.
(c) NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 02 -- 30 November 2010
9 of 14
NXP Semiconductors
BTA312B-800C
3Q Hi-Com Triac
7. Package outline
Plastic single-ended surface-mounted package (D2PAK); 3 leads (one lead cropped)
SOT404
A E A1 mounting base
D1
D
HD
2
Lp
1
3
b c Q
e
e
0
2.5 scale
5 mm
DIMENSIONS (mm are the original dimensions) UNIT mm A 4.50 4.10 A1 1.40 1.27 b 0.85 0.60 c 0.64 0.46 D max. 11 D1 1.60 1.20 E 10.30 9.70 e 2.54 Lp 2.90 2.10 HD 15.80 14.80 Q 2.60 2.20
OUTLINE VERSION SOT404
REFERENCES IEC JEDEC JEITA
EUROPEAN PROJECTION
ISSUE DATE 05-02-11 06-03-16
Fig 12. Package outline SOT404 (D2PAK)
BTA312B-800C
All information provided in this document is subject to legal disclaimers.
(c) NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 02 -- 30 November 2010
10 of 14
NXP Semiconductors
BTA312B-800C
3Q Hi-Com Triac
8. Revision history
Table 7. Revision history Release date 20101130 Data sheet status Product data sheet Change notice Supersedes BTA312B_SER_B_C v.1 Document ID BTA312B-800C v.2 Modifications:
* *
Type number BTA312B-800C separated from data sheet BTA312B_SER_B_C v.1. Various changes to content. Product data sheet -
BTA312B_SER_B_C v.1 20070412
BTA312B-800C
All information provided in this document is subject to legal disclaimers.
(c) NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 02 -- 30 November 2010
11 of 14
NXP Semiconductors
BTA312B-800C
3Q Hi-Com Triac
9. Legal information
9.1 Data sheet status
Product status[3] Development Qualification Production Definition This document contains data from the objective specification for product development. This document contains data from the preliminary specification. This document contains the product specification.
Document status[1][2] Objective [short] data sheet Preliminary [short] data sheet Product [short] data sheet
[1] [2] [3]
Please consult the most recently issued document before initiating or completing a design. The term 'short data sheet' is explained in section "Definitions". The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com.
9.2
Definitions
Draft -- The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet -- A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. Product specification -- The information and data provided in a Product data sheet shall define the specification of the product as agreed between NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet.
Suitability for use -- NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer's own risk. Quick reference data -- The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. Applications -- Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer's sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer's applications and products planned, as well as for the planned application and use of customer's third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer's applications or products, or the application or use by customer's third party customer(s). Customer is responsible for doing all necessary testing for the customer's applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer's third party customer(s). NXP does not accept any liability in this respect. Limiting values -- Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Terms and conditions of commercial sale -- NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective
9.3
Disclaimers
Limited warranty and liability -- Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors' aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. Right to make changes -- NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof.
BTA312B-800C
All information provided in this document is subject to legal disclaimers.
(c) NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 02 -- 30 November 2010
12 of 14
NXP Semiconductors
BTA312B-800C
3Q Hi-Com Triac
product for such automotive applications, use and specifications, and (b) whenever customer uses the product for automotive applications beyond NXP Semiconductors' specifications such use shall be solely at customer's own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors' standard warranty and NXP Semiconductors' product specifications.
agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer's general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. No offer to sell or license -- Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Export control -- This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities. Non-automotive qualified products -- Unless this data sheet expressly states that this specific NXP Semiconductors product is automotive qualified, the product is not suitable for automotive use. It is neither qualified nor tested in accordance with automotive testing or application requirements. NXP Semiconductors accepts no liability for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. In the event that customer uses the product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without NXP Semiconductors' warranty of the
9.4
Trademarks
Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. Adelante, Bitport, Bitsound, CoolFlux, CoReUse, DESFire, EZ-HV, FabKey, GreenChip, HiPerSmart, HITAG, IC-bus logo, ICODE, I-CODE, ITEC, Labelution, MIFARE, MIFARE Plus, MIFARE Ultralight, MoReUse, QLPAK, Silicon Tuner, SiliconMAX, SmartXA, STARplug, TOPFET, TrenchMOS, TriMedia and UCODE -- are trademarks of NXP B.V. HD Radio and HD Radio logo -- are trademarks of iBiquity Digital Corporation.
10. Contact information
For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com
BTA312B-800C
All information provided in this document is subject to legal disclaimers.
(c) NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 02 -- 30 November 2010
13 of 14
NXP Semiconductors
BTA312B-800C
3Q Hi-Com Triac
11. Contents
1 1.1 1.2 1.3 1.4 2 3 4 5 6 7 8 9 9.1 9.2 9.3 9.4 10 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . .1 General description . . . . . . . . . . . . . . . . . . . . . .1 Features and benefits . . . . . . . . . . . . . . . . . . . . .1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . .1 Quick reference data . . . . . . . . . . . . . . . . . . . . .1 Pinning information . . . . . . . . . . . . . . . . . . . . . . .2 Ordering information . . . . . . . . . . . . . . . . . . . . . .2 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . .3 Thermal characteristics . . . . . . . . . . . . . . . . . . .6 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . .7 Package outline . . . . . . . . . . . . . . . . . . . . . . . . .10 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . 11 Legal information. . . . . . . . . . . . . . . . . . . . . . . .12 Data sheet status . . . . . . . . . . . . . . . . . . . . . . .12 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . .12 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . .12 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . .13 Contact information. . . . . . . . . . . . . . . . . . . . . .13
Please be aware that important notices concerning this document and the product(s) described herein, have been included in section `Legal information'.
(c) NXP B.V. 2010.
All rights reserved.
For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 30 November 2010 Document identifier: BTA312B-800C

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